| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS during hypervisor virtual I/O operation in a virtual machine. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Memory corruption in WLAN Host while setting the PMK length in PMK length in internal cache. |
| Memory Corruption in Audio while allocating the ion buffer during the music playback. |
| Memory corruption in Audio while processing IIR config data from AFE calibration block. |
| Memory corruption in Kernel while parsing metadata. |
| Memory corruption during concurrent access to server info object due to unprotected critical field. |
| Memory corruption while operating the mailbox in Automotive. |
| Memory corruption in Audio while running invalid audio recording from ADSP. |
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in Audio during playback with speaker protection. |
| Information disclosure due to buffer over read in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile |
| Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables |